page : 1 PP1191FB recommended applications electric household appliances, oa/fa, pc/peripheral equipment, other general applications ? outer dimension 3.0 x 2.0 x 1.0 mm ( l x w x h ) ? photo current : 1.8 a typ. (v r =5v,ee=5mw/cm 2 ) ? visible radiation cut filter under 700nm ? lead?free soldering compatible ? rohs compliant peak sensitivity wavelength 950nm product features die materials si x = 156 deg., y = 132 deg. features package side viewing type, black vi sible radiation cut filter epoxy half intensity angle 2010.12.15 surface mount pin photodiode/side viewing type soldering methods esd reflow soldering, and manual soldering please refer to soldering conditions about soldering. 2kv (hbm) assembly method auto pick & place machine (auto mounter) taping and reel 3,000pcs per reel in a 8mm width tape. (standard) reel diameter: 180mm
page : 2 PP1191FB absolute maximum ratings item symbol unit power dissipation pd mw reverse voltage v r v operating temperature t opr storage temperature t stg absolute maximum ratings 15 12 -30 +85 -40 +100 (ta=25 ) surface mount photodiode/side viewing type 2010.12.15 electro-optical characteristics conditions min. 1.2 typ. 1.8 max. 2.4 response time v r =10v, r l =1,000 3 tr/tf typ. 60 ns capacity v r =5v, f=1mhz c t typ. 1.6 pf typ. 0.1 max. 20 peak sensitivity wavelength v r =0v ptyp.950nm typ. 156( x) typ. 132( y) 1 color temperature is 2,856k. employs a standard tungsten lamp. 3 response time test circuit. dark current v r =10v i d na 2 x lens long side axis, lens short side axis item symbol characteristics spatial half width 2 photo current v r =5v, ee=5mw/cm 2 1 ip a v r =0v 2 1/2 deg. unit (ta=25 ) laser diode
page : 3 0 20 40 60 80 100 120 300 400 500 600 700 800 900 1000 1100 0.01 0.1 1 10 0.1 1 10 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 -30 -10 10 30 50 70 90 technical data spatial distribution example condition : ta = 25 PP1191FB relative sensitivity vs. wavelength condition : ta = 25 , v r = 0v wavelength [nm] relative sensitivity (%) irradiance vs. relative photo current condition : v r = 5v irradiance ee(mw/cm 2 ) relative photo current it is based on ee=5mw/cm 2 . employs a standard tungsten lamp of 2,856k. ambient temperature vs. relative photo current condition : v r =5v ambient temperature ta( ) relative photo current surface mount photodiode/side viewing type 2010.12.15
page : 4 0 5 10 15 20 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 1.00 1.20 1.40 1.60 1.80 2.00 2.20 2.40 0 2 4 6 8 10 12 14 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 -30 -10 10 30 50 70 90 0.01 0.1 1 02468101214 technical data ambient temperature s. power dissipation ambient temperature ta( ) ambient temperature vs. dark current condition : v r =10v ambient temperature : ta( ) reverse voltage vs. dark current condition : ta=25 reverse voltage : v r (v) dark current : id(na) reverse voltage vs. photo current condition : ee=1mw/cm 2 , ta=25 reverse voltage v r (v) photo current ip [ a] dark current : id(na) PP1191FB surface mount photodiode/side viewing type 2010.12.15 power dissipation pd(mw)
page : 5 1 10 100 0.1 1 10 100 technical data reverse voltage vs. capacitance condition : ta=25 , f = 1mhz reverse voltage v r (v) capacitance ct [pf] PP1191FB surface mount photodiode/side viewing type 2010.12.15
page : 6 package dimensions recommended soldering pattern (unit: mm) taping specification (unit: mm) (unit: mm) quantity: 3,000pcs/ reel (standard) mass: (8.5)mg PP1191FB surface mount photodiode/side viewing type 2010.12.15
page : 7 reflow soldering conditions manual soldering conditions iron tip temp. soldering time and frequency 3 s 1 time 350 (max.) (max.) PP1191FB 1) the above profile temperature gives the maxi mum temperature of the device resin surface. please set the temperature so as to avoid exceeding this range. 2) total times of reflow soldering pr ocess shall be no more than 2 times. when the second reflow soldering process is performed, intervals between the first and second reflow should be short as possible (while allowing some time for the component to return to normal temperature after the first reflow) in order to prevent the device from absorbing moisture. 3) temperature fluctuation to the device during the pre-heating process shall be minimized. surface mount photodiode/side viewing type 2010.12.15
page : 8 reliability testing result failure criteria PP1191FB items symbols conditions failure criteria relitive photocurrent ip v r =5v, ee=5mw/cm 2 testing max. value R initial value x 1.3 testing min. value initial value x 0.7 dark current i d v r =10v testing max. value R 20ma x 2.5 surface mount photodiode/side viewing type 2010.12.15 test item applicable standard duration failure operating life eiaj ed- 4701/100(101) 1,000 h 0/15 high temperature operating life eiaj ed- 4701/100(101) 1,000 h 0/15 low temperature operating life eiaj ed- 4701/100(101) 1,000 h 0/15 wet high temperature operating life eiaj ed- 4701/100(102) 1,000 h 0/15 high temperature storage life eiaj ed- 4701/200(201) 1,000 h 0/15 low temperature storage life eiaj ed- 4701/200(202) 1,000 h 0/15 wet high temperature storage life eiaj ed- 4701/100(101) 1,000 h 0/15 thermal shock eiaj ed- 4701/100(105) 5 cycles 0/15 resistance to reflow soldering eiaj ed- 4701/300(301) 2 times 0/15 testing conditions ta=25 maximum voltage dark condition ta = tstg min. minmum storage temperature ta=60 rh=90% ta=85 v r =5v dark condition ta=30 v r =5v dark condition ta=60 rh=90% v r =5v dark condition ta = tstg max. tstg min. (each 15min) moisture soak 30 70% 72h preheating 150 180 120sec max. soldering 260 5sec ta = tstg max. maximum storage temperature
page : 9 special notice to customer s using the products and technical information shown in this data sheet PP1191FB 1) the technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. it does not co nstitute the warranting of industrial property nor the granting of any license. 2) for the purpose of product improvement, the specif ications, characteristics and technical data described in the data sheets are subject to change without prior notice. therefore it is recommended that the most updated specifications be used in your design. 3) when using the products described in the data sh eets, please adhere to the ma ximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. we are not responsible for any damage which may occur if these specifications are exceeded. 4) the products that have been described to this cata log are manufactured so that they will be used for the electrical instrument of the benchmark (oa equipment, telecommunications equipment, av machine, home appliance and measur ing instrument). the application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high re liability and safety, and the breakdown and the wrong operation might influence the life or the human body. pl ease consult us beforehand if you plan to use our product for the usages of aircrafts, space borne appl ication, transportation equipment, medical equipment and nuclear power control equipment, etc. except oa equipment, telecommunications equipment, av machine, home appliance and measuring instrument. 5) in order to export the products or technologi es described in this data sheet which are under the ?foreign exchange and foreign trade control law,? it is necessary to first obtain an export permit from the japanese government. 6) no part of this data sheet may be reprinted or reproduced without prior written permission from stanley electric co., ltd. 7) the most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com surface mount photodiode/side viewing type 2010.12.15
|
